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1992, 2009 the mark shows major revised points. the revised points can be easily s earched by copying an "" in the pdf file and specifying it in the "find what:" field. 1. anode 2. cathode 3. emitter 4. collector pin connection (top view) 12 43 description the ps2562-1 is optically coupled isol ators containing a gaas light em itting diode and an npn silicon darlington connected phototransistor. the ps2562-1 is in a plastic dip (dual in-line pack age) and the ps2562l-1 is lead bending type (gull-wing) for surface mount. the ps2562l1-1 is lead bending ty pe for long creepage distance. the ps2562l2-1 is lead bending type for long creepage distance (gull-wing) for surface mount. features ? high isolation voltage (bv = 5 000 vr.m.s.) ? high current transfer ratio (ctr = 2 000% typ.) ? high-speed switching (t r , t f = 100 s typ.) ? ordering number of tape produc t: PS2562L-1-F3 : 2 000 pcs/reel : ps2562l2-1-e3: 1 000 pcs/reel ? safety standards ? ul approved: no. e72422 ? csa approved: no. ca 101391 (c a5a, can/csa-c22.2 60065, 60950) ? bsi approved: no. 7112/7420 ? semko approved: no. 903238 ? nemko approved: no. p09210868 ? demko approved: no. 314999 ? fimko approved: no. fi 25119 ? din en60747-5-2 (vde0884 part2) approved: no. 40008862 (option) applications ? power supply ? telephone/fax. ? fa/oa equipment ? programmable logic controller data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. high isolation voltage darlington transistor type multi photocoupler series ? nepoc series ? document no. pn10235ej04v0ds (4th edition) date published november 2009 ns printed in japan photocoupler ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
package dimensions (unit : mm) dip type long creepage distance ps2562-1 3.50.3 4.150.4 3.20.4 2.54 1.250.15 0.500.10 0.25 m 4.60.35 6.50.5 0 to 15 7.62 0.25 +0.1 ?0.05 1 2 4 3 ps2562l1-1 0 to 15 0.25 +0.1 ?0.05 10.16 2.54 0.25 m 0.500.1 1.250.15 3.85 0.4 3.15 0.35 3.50.3 6.50.5 4.60.35 1 2 4 3 lead bending type (gull-wing) long creepage distance (gull-wing) ps2562l-1 0.25 m 4.60.35 6.50.5 3.50.3 2.54 1.250.15 0.90.25 9.600.4 0.25 +0.1 ?0.05 0.1 +0.1 ?0.05 1 2 4 3 ps2562l2-1 0.25 m 2.54 1.250.15 3.50.3 6.50.5 4.60.35 11.8 +0.2 ?0.5 0.25 +0.1 ?0.05 0.250.2 0.90.25 10.16 1 2 4 3 0.15 0.25 photocoupler construction parameter unit (min.) air distance 7 mm outer creepage distance 7 mm inner creepage distance 4 mm isolation thickness 0.4 mm data sheet pn10235ej04v0ds 2 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
marking example 2562 mj931 j assembly lot week assembled year assembled (last 1 digit) in-house code ctr rank code no. 1 pin mark package new pkg made in japan mj 9 31 data sheet pn10235ej04v0ds 3 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
ordering information part number order number solder plating specification packing style safety standard approval application part number *1 ps2562-1 ps2562-1-a pb-free m agazine case 100 pcs standard products ps2562-1 ps2562l-1 ps2562l-1-a (ul, csa, bsi, ps2562l1-1 ps2562l1-1-a semko, nemko, ps2562l2-1 ps2562l2-1-a demko, fimko PS2562L-1-F3 PS2562L-1-F3-a embossed t ape 2 000 pcs/reel approved) ps2562l2-1-e3 ps2562l2-1-e3-a embossed t ape 1 000 pcs/reel ps2562-1-v ps2562-1-v-a m agazine case 100 pcs din en60747-5-2 ps2562l-1-v ps2562l-1-v-a (vde0884 part2) ps2562l1-1-v ps2562l1-1-v-a approved products ps2562l2-1-v ps2562l2-1-v-a (option) ps2562l-1-v-f3 ps2562l-1-v-f3-a embossed tape 2 000 pcs/reel ps2562l2-1-v-e3 ps2562l2-1-v-e3-a embossed tape 1 000 pcs/reel *1 for the application of the safety st andard, following part number should be used. data sheet pn10235ej04v0ds 4 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit diode reverse voltage v r 6 v forward current (dc) i f 80 ma power dissipation derating p d / c 1.5 mw/ c power dissipation p d 150 mw peak forward current *1 i fp 1 a transistor collector to emitter voltage v ceo 40 v emitter to collector voltage v eco 6 v collector current i c 200 ma power dissipation derating p c / c 2.0 mw/ c power dissipation p c 200 mw isolation voltage *2 bv 5 000 vr.m.s. operating ambient temperature t a ?55 to +100 c storage temperature t stg ?55 to +150 c *1 pw = 100 s, duty cycle = 1% *2 ac voltage for 1 minute at t a = 25c, rh = 60% between input and output. pins 1-2 shorted together , 3-4 shorted together. data sheet pn10235ej04v0ds 5 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
electrical characteristics (t a = 25 c) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 10 ma 1.17 1.4 v reverse current i r v r = 5 v 5 a terminal capacitance c t v = 0 v, f = 1.0 mhz 50 pf transistor collector to emitter dark current i ceo v ce = 40 v, i f = 0 ma 400 na coupled current transfer ratio (i c /i f ) *1 ctr i f = 1 ma, v ce = 2 v dc 200 2 000 % collector saturation voltage v ce (sat) i f = 1 ma, i c = 2 ma 1.0 v isolation resistance r i-o v i-o = 1.0 kv dc 10 11 isolation capacitance c i-o v = 0 v, f = 1.0 mhz 0.5 pf rise time *2 t r v cc = 10 v, i c = 10 ma, r l = 100 100 s fall time *2 t f 100 *1 ctr rank k : 2 000 to (%) l : 700 to 3 400 (%) m : 200 to 1 000 (%) *2 test circuit for switching time v cc v out r l = 100 50 i f pulse input pw = 1 ms duty cycle = 1/10 data sheet pn10235ej04v0ds 6 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
typical characteristics (t a = 25c, unless otherwise specified) 150 100 50 02550 75 100 125 150 0.5 0.1 1 5 10 50 100 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 20 40 60 80 100 120 140 160 2 46810 5 ma 2 ma 1 ma i f = 0.5 ma 10 1 100 1000 10 000 ?50 ?25 0 25 50 75 100 0.2 0.5 1 5 10 200 50 0.4 100 0.6 0.8 1.0 1.2 1.4 1.6 5 ma 2 ma 1 ma 0.5 ma i f = 0.1 ma 0.2 ma 1.5 mw/ c 0 c ?25 c ?55 c v ce = 2 v 5 v 10 v 24 v 40 v +60 c +25 c t a = +100 c diode power dissipation p d (mw) transistor power dissipation p c (mw) ambient temperature t a ( c) forward current i f (ma) forward voltage v f (v) collector current i c (ma) collector to emitter voltage v ce (v) collector to emitter dark current i ceo (na) collector saturation voltage v ce (sat) (v) ambient temperature t a ( c) ambient temperature t a ( c) diode power dissipation vs. ambient temperature transistor power dissipation vs. ambient temperature forward current vs. forward voltage collector current vs. collector to emitter voltage collector to emitter dark current vs. ambient temperature collector current vs. collector saturation voltage collector current i c (ma) 150 100 50 02550 75 100 125 150 2 mw/ c 200 remark the graphs indicate nominal characteristics. data sheet pn10235ej04v0ds 7 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
1.4 25 1.2 1.0 0.8 0.6 0.4 0.2 ?50 0 ?25 50 75 100 8 000 0 1 000 2 000 3 000 4 000 5 000 6 000 7 000 v ce = 2 v 0.1 0.5 1 5 10 30 1 000 500 100 50 10 5 2 100 50 500 1 k 5 k v cc = 5 v, i c = 2 ma, ctr = 2 280% t f 500 50 1 k 300 10 100 1 000 5 000 10 000 5 k 10 k 50 k 5 10 0.2 0.5 1 2 20 50 100 200 i f = 1 ma, v ce = 2 v ?20 ?15 ?10 ?5 0 1 500 2 000 2 500 3 000 0 500 1 000 v ce = 2 v 50 100 10 500 r l = 100 v cc = 5 v, i f = 1 ma, ctr = 2 280% t d t s 30 500 100 k t f t s t r t d t r normalized to 1.0 at t a = 25 c, i f = 1 ma, v ce = 2 v forward current i f (ma) ambient temperature t a ( c) load resistance r l ( ) frequency f (khz) normalized current transfer ratio ctr current transfer ratio ctr (%) normalized gain g v load resistance r l ( ) switching time t ( s) normalized current transfer ratio vs. ambient temperature current transfer ratio vs. forward current switching time vs. load resistance switching time vs. load resistance frequency response switching time t ( s) forward current i f ( a) current transfer ratio ctr (%) current transfer ratio vs. forward current sample a b c d sample a b c d remark the graphs indicate nominal characteristics. data sheet pn10235ej04v0ds 8 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
10 10 2 10 3 10 4 10 5 10 6 0.6 0 0.2 0.4 0.8 1.0 1.2 t a = 25 c t a = 60 c time (hr) ctr (relative value) long term ctr degradation i f = 1 ma remark the graph indicates nominal characteristics. data sheet pn10235ej04v0ds 9 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
taping specifications (unit : mm) tape direction PS2562L-1-F3 outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.5 max. 4.0 0.1 0.4 5.30.1 8.00.1 7.50.1 16.00.3 10.30.1 1.5 +0.1 ?0 outline and dimensions (reel) packing: 2 000 pcs/reel 2.00.5 r 1.0 13.00.2 21.00.8 3302.0 1001.0 2.00.5 15.9 to 19.4 outer edge of flang 21.51.0 17.51.0 data sheet pn10235ej04v0ds 10 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
tape direction ps2562l2-1-e3 outline and dimensions (tape) 2.050.1 2.00.1 4.00.1 1.550.1 1.750.1 4.40.2 12.350.15 0.38 11.50.1 24.00.3 6.60.2 12.00.1 outline and dimensions (reel) packing: 1 000 pcs/reel 2.00.5 r 1.0 13.00.2 data sheet pn10235ej04v0ds 11 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220 c 180 c package surface temperature t ( c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260 c max. 120 c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron ? peak temperature (l ead part temperature) 350 c or below ? time (each pins) 3 seconds or less ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead. (b) please be sure that the temperatur e of the package woul d not be heated over 100 c. data sheet pn10235ej04v0ds 12 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
(4) cautions ? fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly bet ween the photocoupler?s i nput and output or between collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. 3. measurement conditions of current transfer ra tios (ctr), which differ according to photocoupler check the setting values before use, since the forward current conditions at ctr measurement differ according to product. when using products other than at the specified forward current, the char acteristics curves may differ from the standard curves due to ctr value variati ons or the like. theref ore, check the characte ristics under the actual operating conditions and thoroughly take variations or the like into cons ideration before use. usage cautions 1. protect against static electricity when handling. 2. avoid storage at a high te mperature and high humidity. data sheet pn10235ej04v0ds 13 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
specification of vde marks license document parameter symbol speck unit climatic test class (iec 60068-1/din en 60068-1) 55/100/21 dielectric strength maximu m operating isolation voltage test voltage (partial discharge test pr ocedure a for type test and random test) u pr = 1.5 u iorm , p d < 5 pc u iorm u pr 890 1 335 v peak v peak test voltage (partial discharge test procedure b for all devices test) u pr = 1.875 u iorm , p d < 5 pc u pr 1 669 v peak highest permissible overvoltage u tr 8 000 v peak degree of pollution (din en 60664-1 vde0110 part 1) 2 comparative tracking index (iec 60112/din en 60112 (vde 0303 part 11)) cti 175 material group (din en 60664-1 vde0110 part 1) iii a storage temperature range t stg ?55 to +150 c operating temperature range t a ?55 to +100 c isolation resistance, minimum value v io = 500 v dc at t a = 25 c v io = 500 v dc at t a max. at least 100 c ris min. ris min. 10 12 10 11 safety maximum ratings (maximum permi ssible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) power (output or total power dissipation) isolation resistance v io = 500 v dc at t a = 175 c (tsi) tsi isi psi ris min. 175 400 700 10 9 c ma mw data sheet pn10235ej04v0ds 14 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
the information in this document is current as of november, 2009. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec e lectronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. in addition, nec electronics products are not taken measures to prevent radioactive rays in the product design. when customers use nec electronics products with their products, customers shall, on their own responsibility, incorporate sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in order to avoid risks of the damages to property (including public or social property) or injury (including death) to persons, as the result of defects of nec electronics products. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e0904e (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific": data sheet pn10235ej04v0ds 15 ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. ? do not burn, destroy, cut, crush, or chemically di ssolve the product. ? do not lick the product or in any way allow it to enter the mouth. ps2562-1,ps2562l-1,ps2562l1-1,ps2562l2-1
to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? 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